EU PVSEC Programme Online
EU PVSEC 2021, 6 - 10 September 2021
Presentation: 4BO.5.5 Power Loss Analysis and Interconnection of SHJ Structure: from Cell to Module
Type: Oral
Date: Tuesday, 7th September 2021
17:00 - 18:30
Author(s): J. Yu, Y. Zhao, L.S. Peris, A. Lambertz, W. Duan, V. Volker, C. Zahren, K. Ding
Presenter / Speaker: Y. Zhao, Forschungszentrum Jülich, Jülich, Germany
Event: Conference Conference
Session: 4BO.5 Interconnects and Soldering
Topic: 4. 1 PV Module Design, Manufacture, Performance and Reliability
Summary / Abstract: The temperature limitation of high efficiency silicon heterojunction (SHJ) solar cell 6 results in the resistivity of low-temperature silver pastes three times higher than that of the high-temperature 7 counterparts [1]. With a SHJ solar cell demanding ~350 mg usage of silver paste (5 busbars, bifacial), the cost 8 of low temperature silver paste is ~30 ¢/cell at today’s price for silver paste (~$ 900/kg). Thus, enhanced 9 power output and reduced use of expensive silver paste becomes the essential for high efficiency and low-cost 10 SHJ solar cell mass production [2,3]. 11 This research analyzed and compared the power losses of SHJ solar cell and module with different 12 interconnection schemes. Simulated results show that the power loss caused by electrodes is closely related to 13 bulk resistivity, contact resistance, finger design, busbar width and busbar number. As a proof-of-concept, 14 single-cell modules were encapsulated with Glass/TPO/Backsheet structure to analyze the power loss.