EU PVSEC Programme Online
EU PVSEC 2021, 6 - 10 September 2021
Presentation: 1AO.3.5 Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells
Type: Oral
Date: Monday, 6th September 2021
17:00 - 18:30
Author(s): N.S. Pujari, P.M. Krithika, S. Sarkar, C. Bilgrien
Presenter / Speaker: N.S. Pujari, Macdermid Alpha Electronics Solutions, Bangalore, India
Event: Conference Conference
Session: 1AO.3 Innovative Approaches for Module Concepts
Topic: 1. 2 New Materials and Concepts for Cells and Modules
Keywords: Solder Paste, Structured Ribbons, Soldering, Tabbing
Summary / Abstract: We report tin-lead (Sn-Pb) and low temperature lead free solder pastes for interconnecting structured ribbons. Lead free option was tin-bismuth (Sn-Bi) based engineered non eutectic alloy HRL1. We found an acceptable wettability and printability of both the solder pastes. These pastes show excellent stability, long stencil life and consistent transfer efficiency (>90 %). Solder joints were strong with peel strength more than 2N/mm and voiding less than 10 %, indicating bonds have better contacts and complete wetting. We found that solder paste based assemblies yield uniform intermetallic compound (IMC) formation and no loss in power output. Both pastes could be fast reflowed and laminated with EVA. The modules assembled using these pastes pass thermal-cycling and damp heat reliability testing according to IEC61215. Our results suggests that solder pastes could be an attractive alternative to expensive electrically conductive adhesives for interconnecting structured ribbons.