EU PVSEC Programme Online
EU PVSEC 2021, 6 - 10 September 2021
Presentation: 3AO.4.1 Scale Up of Perovskite/Silicon Tandem Devices: Advances in Metallization, Silicon Surface Preparation, and Meniscus Coating for Rapid Fabrication of Large Area Devices
Type: Oral
Date: Monday, 6th September 2021
13:30 - 15:00
Author(s): B.A. Kamino, T. Offermans, B. Paviet-Salomon, A. Walter, C. Allebé, G. Christmann, L. Lauber, P. Wyss, A. Paracchino, C. Ballif, S. Nicolay
Presenter / Speaker: B.A. Kamino, CSEM, Neuchâtel, Switzerland
Event: Conference Conference
Session: 3AO.4 Tandem Upscaling towards Industrialisation
Topic: 3. 5 Tandems
Summary / Abstract: Perovskite-silicon tandem solar cells are one of the most promising technologies to enable commercial solar panels to surpass the practical single junction limit and continue to drive down the LCOE of commercial PV panels through increased electrical yields. With small laboratory devices now exceeding 29%,[1] it is clear that this approach has significant potential to be a transformative technology in the field. However, the translation of these small laboratory devices to standard PV wafers requires significant work on a number of different fronts while still conforming to the extremely high throughput and cost limitations required by modern PV manufacturing. To this end, we have sought to tackle a number of these challenges by adapting standard industrial processing techniques that are currently used in cSi PV or in other commercial semiconductors to this device type. The final goal being to demonstrate a commercially viable pathway that could be adaptable to existing industrial manufacturing lines. Key to achieving this final goal is surmounting the following three challenges: 1) efficient low-temperature printed metallization, 2) the rapid, large area deposition of perovskite layers over the wafer surface and 3) wet-chemical texturing of the silicon surface to be compatible with perovskite deposition. Solutions to these challenges are presented herein culminating in the demonstration of a relatively large area PK/Si tandem device (100 cm2 ) which is based on a M2 CZ bottom cell with a chemically etched front surface, printed Ag metallization, and a rapid PK deposition technique based on low-toxicity solvents. Initial device efficiencies of over 23% have been measured demonstrating the potential of this approach.